1. packing method SOT502B cdfm2; blister pack; standard product orientation 12nc ending 112 rev. 1 ? 30 november 2012 packing information cdfm2 fig 1. blister pack barcode label preprinted esd warning space for additional label esd label esd label blister cover qa seal tape printed plano box blister bottom foam msc071
nxp semiconductors SOT502B cdfm2; blister pack; standard product orientation 12nc ending 112 ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 30 november 2012 document identifier: SOT502B_112 limited warranty and liability information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such info rmation and shall have no liability for the consequences of use of such information. table 1. packing information package version 12nc ending spq per carrier pq (pcs) carriers per box outer box dimensions l x w x h (mm) SOT502B 112 20 60 3 315 x 118 x 78
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